Presaturated IPA Wipes are designed for removing solder paste residue and other viscous materials from stencil apertures and contact surfaces. Their high absorbency and strong tensile strength provide effective cleaning performance while helping reduce cleaning cycle time.
Ideal for use with stencils, tools, misprinted boards, and other production equipment. The wipes feature extremely low particle generation and excellent liquid absorption, making them suitable for demanding electronics manufacturing and precision cleaning applications.
Available with two different wipe materials to match the application:
FPS: Designed for ultra-fine pitch applications and as an alternative to Sontara™ material.
PLP: Hydraulically interlaced fibers manufactured without chemical bonding.
Available with 70% IPA / 30% DI water or 100% IPA.
Size: 6" x 9"
Quantity: 100 wipes
Packaging: Canister or Refill
Presaturated IPA Wipes are designed for removing solder paste residue and other viscous materials from stencil apertures and contact surfaces. Their high absorbency and strong tensile strength provide effective cleaning performance while helping reduce cleaning cycle time.
Ideal for use with stencils, tools, misprinted boards, and other production equipment. The wipes feature extremely low particle generation and excellent liquid absorption, making them suitable for demanding electronics manufacturing and precision cleaning applications.
Available with two different wipe materials to match the application:
FPS: Designed for ultra-fine pitch applications and as an alternative to Sontara™ material.
PLP: Hydraulically interlaced fibers manufactured without chemical bonding.
Available with 70% IPA / 30% DI water or 100% IPA.
Size: 6" x 9"
Quantity: 100 wipes
Packaging: Canister or Refill
