SMT Dry Wipes are designed for removing solder paste residue and other viscous materials from stencil apertures and stencil contact surfaces. The FPS material is designed to work with ultra-fine pitch apertures while providing high absorption to improve cleaning performance and reduce cleaning cycle time.
The material combines high tensile strength with excellent absorbency and extremely low particle generation, making these wipes well suited for demanding electronics manufacturing and precision cleaning applications.
Features include 600% liquid absorption, high tensile strength, micro-low particle generation, and a two-year shelf life in accordance with J-STD-001 Section 4.2.2.
Size: 9" x 9"
Available in packages of 150 or 300 wipes.
SMT Dry Wipes are designed for removing solder paste residue and other viscous materials from stencil apertures and stencil contact surfaces. The FPS material is designed to work with ultra-fine pitch apertures while providing high absorption to improve cleaning performance and reduce cleaning cycle time.
The material combines high tensile strength with excellent absorbency and extremely low particle generation, making these wipes well suited for demanding electronics manufacturing and precision cleaning applications.
Features include 600% liquid absorption, high tensile strength, micro-low particle generation, and a two-year shelf life in accordance with J-STD-001 Section 4.2.2.
Size: 9" x 9"
Available in packages of 150 or 300 wipes.
